Description
200 g or 500 g spools 3DSolex PEEK Engineer Filament.
This product is especially formulated and made for 3DSolex to print with low temperature
build chamber.
Will print well from build chamber 40 C and upwards, Nozzle temp 375 C +
Bed build plate temp 110 C.
Resist 250 C continuous exposure after print.
Images coming, filament in production.
